Application of TCE-PCM based heat sinks for cooling of electronic components: A review
2016-06-24
org.kosen.entty.User@2212a97f
김채형(avalonkch)
행사&학회소개
1.Introduction
2. Heat sink using PCM filled with internal fins
2.1.Performance of fin based heat sink under constant thermal load
2.2. Performance of fin based heat sink under variable thermal load
2.3. Summary
3. Heat sink using PCM mixed with nano particles
3.1.Performance of heat sink using PCM mixed with nano particles under constant thermal load
3.2. Performance of heat sink using PCM mixed with nano particles under variable thermal load
4. Heat sink using PCM filled in metallic foams
4.1.Performance of heat sink using PCM filled in metallic foams under constant thermal load
4.2. Performance of heat sink using PCM filled in metallic foams under variable thermal Load
4.3. Comparison of nano particle and metal foam as thermal conductivity enhancer
4.4. Summary
5. Conclusion
2. Heat sink using PCM filled with internal fins
2.1.Performance of fin based heat sink under constant thermal load
2.2. Performance of fin based heat sink under variable thermal load
2.3. Summary
3. Heat sink using PCM mixed with nano particles
3.1.Performance of heat sink using PCM mixed with nano particles under constant thermal load
3.2. Performance of heat sink using PCM mixed with nano particles under variable thermal load
4. Heat sink using PCM filled in metallic foams
4.1.Performance of heat sink using PCM filled in metallic foams under constant thermal load
4.2. Performance of heat sink using PCM filled in metallic foams under variable thermal Load
4.3. Comparison of nano particle and metal foam as thermal conductivity enhancer
4.4. Summary
5. Conclusion
보고서작성신청
일반적으로 사용되는 전기부품들은 열부하 때문에 100도 미만에서 작동하도록 요구된다. 이와 같은 전기 부품들의 전기열부하를 즐이기 위해 PCM(상변환 물질) 기반의 방열기와 ,TCE(열전달 증대기)를 사용한 전기 부품의 냉각 기술에 대한 내용들을 본 보고서는 정리하고 있다.