1999-10-29
org.kosen.entty.User@c839e97
김보영(ostin1)
첨부파일
Information Sheet - DERA
- Advanced Process Control: Real-Time monitoring and control of composition and thickness of cmplex semiconductor structures
- Silicon deep dry etching for high aspect ratio micromachining: Process Development, Design & Foundry Services High Aspect Ratio Micromachining in SOI
- Silicon-Germanium Devices: Advanced SiGe materials for microelectronics
- Polysilicon Microheaters: Fabrication, Characteristics and Applications
- Microfluidics: Prototypes systems
- Polysilicon sacrificial surface micromachining: Process Development, Design & Foundry Services
- Advanced Process Control: Real-Time monitoring and control of composition and thickness of cmplex semiconductor structures
- Silicon deep dry etching for high aspect ratio micromachining: Process Development, Design & Foundry Services High Aspect Ratio Micromachining in SOI
- Silicon-Germanium Devices: Advanced SiGe materials for microelectronics
- Polysilicon Microheaters: Fabrication, Characteristics and Applications
- Microfluidics: Prototypes systems
- Polysilicon sacrificial surface micromachining: Process Development, Design & Foundry Services
-
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