KOSEN 한인과학기술자네트워크

Technical Highlights ㅇ New X-ray imaging technique shed light on fundamentals of metal forming ㅇ Improving giant magnetoresistance materials by controlling interface growth processes ㅇ Large uniaxial anisotropy for thin film magnetization pinning ㅇ Electrodeposited copper for on-chip interconnects : Tools for the microelectronics industry ㅇ Lead-free solders : Tools for the microelectronics industry ㅇ The solder interconnect design team : Helping industry solve failure and design challenges ㅇ Recommended practice guide : Rockwell hardness measurement of metallic materials ㅇ Phase field modeling of solidification and grain boundaries : NIST as a world leader Combinatorial Methods ㅇ Combinatorial Methods for industrial processes Data Evaluation and Delivery ㅇ Thermodynamic databases for industrial processes Forming of lightweight materials ㅇ Standard test method development for sheet metal formability ㅇ Surface roughening and homogeneity of plastic deformation ㅇ Fundamental studies of plastic deformation ㅇ Process models for particle-reinforced composites Magnetic materials ㅇ Giant magnetoresistance materials ㅇ Processing and Micromagnetics of thin magnetic films ㅇ Magnetic properties of nanostructured materials ㅇ Magneto-optical indicator film (MOIF) measurements Materials for microelectronics ㅇ Solder and solderability measurements for microelectronics ㅇ Assembly of IC chips utilizing wafer-level underfill ㅇ Metallurgy of electrical contacts to GaN-based semiconductors ㅇ Evaluation of bond pads for wire bonding ㅇ Measurements for electrodeposited copper ㅇ Electrodeposited of alloys : Pb-free solders Metals characterization ㅇ Thermophysical properties during pulse heating ㅇ Mechanical properties of multilayered and nanomaterials ㅇ Hardness standardization rockwell, vickers, knoop ㅇ Magnetic properties and stadard reference materials ㅇ Electrodeposited coating thickness standards ㅇ Nanoscale characterization : Electron microscopy Metals Processing ㅇ Modeling of solidification and microstructure development ㅇ Sensors and dialgnostics for thermal spray ㅇ Tailored metallic powders ㅇ Electrodeposition of alumunum alloys ㅇ Electrochemical processing of nanostructural materials ㅇ Reaction path analysis in multicomponent systems