KOSEN 한인과학기술자네트워크

>반도체와 PCB를 납땜 없이 전기적으로 연결해주는 기술 관련 >최근 해외동향 부탁드립니다. >국내에선 납땜 대신 이방성 전도 접착제 (Anisotropic Conductive Adhesive)사용하여 연결하는 연구가 진행중인것으로 알고 있습니다. >이런기술 관련해서 해외 기술 동향 부탁드립니다. 아래의 자료는 산업기술정보원(www.kiniti.re.kr)의 영문DB 및 한글DB를 통해 검색된 관련자료입니다. 그곳에서 원문신청이 가능하오니 참고하시기 바랍니다. 8 INSP199805905931 Bonding characteristics of anisotropic conductive adhesive of chip on glass technology [for LCD module] 1998 9 INSP199705477984 Anisotropic conductive adhesive films for flip-chip interconnection 1997 10 INSP199906315820 Flip chip interconnect using anisotropic conductive adhesive 199907 11 INSP199806118650 Anisotropic conductive adhesive films for flip-chip interconnection onto organic substrates 1998 12 INSP200006482597 Microwave model of anisotropic conductive adhesive flip-chip interconnections for high frequency applications 200004 13 INSP199906250714 High-frequency measurements and modelling of anisotropic electrically conductive adhesive flip-chip joint 199905 14 INSP199906161731 Development of 3-dimensional memory module using anisotropic conductive adhesive films 199902 1 BIST199811145447 특집 반도체 관련 전자 재료의 신조류 : 도전성 접착제 2 BIST199911129820 반도체 밀봉용 에폭시 수지 성형 재료의 접착 강도에 미치는 커플링제의 효과 3 BIST199711171571 특집 납이 필요 없는 것에 대한 도전 : 반도체 실장용 실리콘 접착제와 그 동향 4 BIST199911132599 깊은 서브 미크론 시대의 반도체 관련 재료: 연 핸더 대체 도전성 접착제 5 BIST199605047219 직접 접착에 의한 3-5 족 화합물 반도체의 임의 재료 면방위 집적화 기술 6 BIST199710152608 특집 반도체 관련 전자 재료의 최신 동향 : 고전력용 고열 전도 열가소성 접착제 7 BIST200004009767 반도체 장치 및 접착 결합부의 열적 특성: 이중 이질 구조 레이저다이오드에 응용 다음의 자료는 LG상남도서관(www.lg.or.kr)을 통해 검색된 자료입니다. 참고하시기 바랍니다. Development of conducting adhesive materials for microelect ronic applications Journal of Electronic Materials ,V.28 N.11 ,1999 -11 -01 2. Flip chip interconnect using anisotropic conductive adhesiv e Journal of Materials Processing Technology ,V.89-90 ,1999 -05 -19 3. CONDUCTIVE ADHESIVES FOR HIGH-FREQUENCY APPLICATIONS IEEE Transactions on Components Packaging & Manufacturing Technology Part A ,V.21 N.3 ,1998 -09 -01 4. DESIGN AND UNDERSTANDING OF ANISOTROPIC CONDUCTIVE FILMS (A CFS) FOR LCD PACKAGING IEEE Transactions on Components Packaging & Manufacturing Technology Part A ,V.21 N.2 ,1998 -06 -01 5. RELIABILITY OF ELECTRICALLY CONDUCTIVE ADHESIVE JOINTS FOR SURFACE MOUNT APPLICATIONS - A SUMMARY OF THE STATE OF THE ART IEEE Transactions on Components Packaging & Manufacturing Technology Part A ,V.21 N.2 ,1998 -06 -01 6. OVERVIEW OF CONDUCTIVE ADHESIVE INTERCONNECTION TECHNOLOGIE S FOR LCDS IEEE Transactions on Components Packaging & Manufacturing Technology Part A ,V.21 N.2 ,1998 -06 -01 7. SOME OPTIMUM PROCESSING PROPERTIES FOR ANISOTROPIC CONDUCTI VE ADHESIVES FOR FLIP CHIP INTERCONNECTION Journal of Materials Science-Materials in Electronics ,V.8 N.4 ,1997 -08 -01 8. Reliability Study of Flip Chip on FR4 Interconnections with ACA Proceedings of the 49th Electronic Components & Technology Conference , ,1999 -06 -01 9. Microwave Model of Anisotropic Conductive Adhesive Flip-Chi p Interconnections for High Frequency Applications Proceedings of the 49th Electronic Components & Technology Conference , ,1999 -06 -01 10. Development of Novel Anisotropic Conductive Film (ACF) Proceedings of the 49th Electronic Components & Technology Conference , ,1999 -06 -01 11. Integrated Circuit Packaging with Laminated MicroInterconn ect Proceedings of the 49th Electronic Components & Technology Conference , ,1999 -06 -01 12. Electrically Anisotropic Conductive Adhesives: A New Model for Conduction Mechanism Proceedings of the International Symposium on Advanced Packaging Materials , ,1999 -03 -14 13. Anisotropic Conductive Adhesive Films for Flip-chip Interc onnection onto Organic Substrates Proceedings of the 1998 IEMT/IMC Symposium , ,1998 -04 -15 14. A Roadmap to Low Cost Flip Chip and CSP using Electroless Ni/Au Proceedings of the 1998 IEMT/IMC Symposium , ,1998 -04 -15 15. THE FINE PITCH DIRECT BONDING TECHNOLOGY FOR CHIP INTERCON NECTION Proceedings of the 1998 IEMT/IMC Symposium , ,1998 -04 -15 16. HIGH-FREQUENCY MEASUREMENTS AND MODELLING OF ANISOTROPIC E LECTRICALLY CONDUCTIVE ADHESIVE FLIP-CHIP JOINT Proceedings of the Advances in Electronic Packaging 1997 - Volume 1 ,V.1 ,1997 -06 -15 17. Novel Anisotropic Conductive Films with Area-Arrayed Condu cting Particles Proceedings of the Advances in Electronic Packaging 1997 - Volume 1 ,V.1 ,1997 -06 -15 18. ANISOTROPIC ALIGNMENT OF NICKEL PARTICLES IN MAGNETIC FIEL D FOR ELECTRONICALLY CONDUCTIVE ADHESIVES APPLICATIONS Proceedigns of the 20th Annual "Anniversary" Meeting of the Adhesion Society , ,1997 -01 -23 또한 다음의 사이트에 가시면 관련기술동향 정보를 얻으실 수 있을 겁니다. 반도체산업협회 세미파크