KOSEN 한인과학기술자네트워크

한국과학기술정보연구원의 KINITI홈페이지를 방문하셔서 기술정보통합검색의 영문DB를 통해 BGA관련 검색을 실행하시면 관련 문헌들이 검색되어집니다. 아래의 내용들은 BGA and standard? and x-ray라는 검색어를 통해 얻어진 결과입니다. 정확하게 원하시는 자료인지는 잘 모르겠습니다.(^^) 한번 살펴보시고 원하시는 자료가 아니라면 위 사이트를 통해 직접 검색를 해 보시면 도움이 되실 것 같습니다. * Establishing BGA acceptance criteria, Miller, D., Circuits Assem. (USA) vol.10, no.9 (Sept. 1999) (USA), p50-6, 1 ref(s) CODEN: CIATE5 Abstract : The use of ball grid array (BGA) packages and other area array devices is quickly becoming standard in modern PCB design. Many electronics assemblers are faced with an inspection dilemma: ensuring correct assembly and achieving process yields when traditional verification methods are no longer sufficient. An increasing number of manufacturers are selecting X-ray to satisfy inspection requirements. By using X-ray inspection, the characteristics of hidden solder joints of BGAs, micro-BGAs and flip chip devices can be checked in a reliable and nondestructive manner early in the production run. Also, most personnel can make the pass/fail determination. Until BGAs were incorporated into product designs, most PCB manufacturers did not use X-ray systems in their inspection process. Traditional methods, however, do not provide adequate detection of hidden solder problems such as voids, cold solder joints and poor solder adhesion. X-ray inspection can detect these types of problems effectively, monitor quality assurance and provide immediate feedback for proactive process control * Factors that affect void formation in BGA assembly, Primavera, A.; Sturm, R.; Prasad, S.; Srihari, K.;, IPC/SMTA Electronics Assembly Expo. Proceedings of the Technical Program (1998), p798, ppS2ba-g, 13 ref(s) Abstract : BGAs have emerged as robust packaging for applications requiring high I/O counts on limited PCB real estate. Due to the leadless configuration, large ball pitch, and standard SMT assembly equipment compatibility, BGAs avoid a large segment of assembly problems encountered in fine pitch PCB assembly. However, while BGA use has steadily increased, it is not considered significantly widespread. Recent explosive growth in BGA development has been fueled by the promise of exceptionally high assembly yields. One major BGA process development issue is in the area of joint quality and inspection. Often, BGAs are suspect at the production test and burn-in stage due to the inability to visually inspect the joints. While transmission X-ray inspection can assist in inspection of joint related parameters such as voids, the impact on joint integrity is difficult to assess. This paper addresses some factors that influence void formation in BGA assembly. The effects of void size and frequency on joint reliability are addressed. Factors that affect void formation in BGA assemblies can be classified into several categories, including process methods, solder and flux materials, component ball alloy, attachment metallurgy, reflow atmosphere, and oxidation levels on solderable surfaces. The influence of several factors in each category is discussed. The process methods can be further sub-divided into equipment-related parameters such as reflow parameters, fluxing and solder paste deposition methods, and handling and storage conditions. This paper also considers the impact of void size and frequency on long term joint robustness * Shear testing and failure mode analysis for evaluation of BGA ball attachment, Erich, R.; Coyle, R.J.; Wenger, G.M.; Primavera, A.;, Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) (1999), pxiv+479, pp16-22, 9 ref(s) SBN: 0-7803-5502-4 Abstract : With increasing focus on BGA technology as a high performance package, there is an urgent need to develop industry-wide standards for package quality and reliability. A significant factor in BGA package quality is the robustness of solder ball attachment to the package. Currently, ball shear testing is used to assess solder joint integrity. The solder ball failure mechanism can not be determined from shear force data alone, but is critical to understanding solder joint quality. A failure mode analysis, along with a fundamental understanding of the shear test process, is needed to assess solder joint quality. A common pad finish on BGA packages and PWB substrates is Ni/Au, using either electrolytic or electroless deposition. There are reports of brittle fracture in BGA and PWB interconnects with both types of Ni/Au surface finishes. During post-assembly test and manufacturing, the solder to pad interconnection has been shown to separate under certain conditions. In this study, ball shear testing is performed in conjunction with thermal preconditioning to evaluate brittle fractures on a thermally enhanced BGA with electroless Ni/Au bond pads and on a plastic BGA with electrolytic Ni/Au bond pads. Cross sectioning and fractography reveal interfacial failure in both package types. However, metallography and SEM with EDX confirm two distinct interfacial failure mechanisms. The failure analysis is interpreted in terms of the implications for package quality and performance. Although this evaluation is performed on BGA packages, the failure analysis results are applicable to brittle fractures on PWBs using a Ni/Au surface finish * The many choices of BGA X-ray inspection, Walquist, C., Surf. Mount Technol. (USA) vol.10, no.11 (Nov. 1996) (USA), p50, 52-3, 0 ref(s) CODEN: SMTEEL Abstract : From basic manual systems to fully automated in-line process monitors, selection must be based on effectiveness for inspecting traditional as well as advanced devices. Traditional applications of X-ray imaging continue to be the best solution for PCB and BGA assembly inspection. The BGA process engineer must deal with the complexities of continuously changing process and component variables, and inspection equipment manufacturers must remain committed to making the tools as easy to use as possible. The newer technologies are evolving and becoming an accepted standard, reinforcing the need for effective nondestructive process monitoring and inspection. Real-time microfocus X-ray has proven its value as an inspection tool for advanced components including BGA and COB. When integrated with powerful software tools X-ray can continue to meet assembly inspection needs on many different levels from manual through fully automated in-line systems * Controlling BGA assembly using X-ray laminography, Rooks, S., Electron. Packag. Prod. (USA) vol.37, no.1 (Jan. 1997) (USA), p24-6, 28, 30, 5 ref(s) CODEN: ELPPA5 Abstract : Despite the performance and assembly advantages of BGA components over standard components, many manufacturers are still reluctant to invest aggressively in the development of high-volume BGA production capability. This unwillingness stems from the difficulty in measuring BGA solder joints. Those manufacturers who currently are assembling BGA components in moderate to high volumes rely primarily on electrical test to screen BGA defects. Other methods used during BGA assembly to control the assembly process and identify defects include taking sample measurements at paste screening and using X-ray inspection for auditing assembly output and analyzing electrical test fallout. X-ray laminography inspection of BGA solder joints can quickly and accurately identify defects >안녕하세요.. > >다름이아니라. PCB(Printed circuit board)에 장착되는 BGA(ball grid array)를 X선 검사에서 BGA 납볼의 불량여부를 판별하는 기준이나 이와 관련한 다른 판별 기준들이 있는 자료를 구하고 싶습니다. >또는 관련 논문을 구하고 싶습니다. > >또한, 이런 기준을 적용하여 library화 된 software가 있나요? > >관련 자료를 알고 계시면 꼭 좀 알려주세요. > >답장 기다리겠습니다. >

>안녕하세요.. > >다름이아니라. PCB(Printed circuit board)에 장착되는 BGA(ball grid array)를 X선 검사에서 BGA 납볼의 불량여부를 판별하는 기준이나 이와 관련한 다른 판별 기준들이 있는 자료를 구하고 싶습니다. >또는 관련 논문을 구하고 싶습니다. > >또한, 이런 기준을 적용하여 library화 된 software가 있나요? > >관련 자료를 알고 계시면 꼭 좀 알려주세요. > >답장 기다리겠습니다. > Microelectronics Reliability에 실린 보고서입니다. 참고하시길 바랍니다.