KOSEN 한인과학기술자네트워크

>압축시험을 하려고 합니다. >시편의 규격과 testing speed를 알고 싶습니다. >또한, 시험조건을 상세히 알고 싶거든요... >다이아몬드공구를 제조하기 위해서 다이아몬드와 분말을 혼합하여 소결을 할 경우 , 제조된 소결체의 압축강도를 알고자 의뢰하는 겁니다. >피삭재와의 충격 및 연마에 의해 피삭재를 절단할 경우 소결된 팁이 부서지는 즉, chipping이 발생하여 이를 해결하고자 소결체의 압축시험을 하는 겁니다. >인장시험편의 제조는 매우 어렵습니다.(다이아몬드가 금속분말과 소결되어진 상태) ========================================================== You can find some information related to a compression test of diamond composite in this paper. Fracture toughness and thermal resistance of polycrystalline diamond compacts D. Miessa, * and G. Raia Materials Science and Engineering A Volume 209, Issues 1-2 May 1996 Pages 270-276 a Smith MegaDiamond Provo, UT USA Abstract Polycrystalline diamond compacts (PCD) are being used increasingly for oil and gas drilling and in machining of ceramics and hard non-ferrous materials. Average diamond grain size and its distribution are used as one of the means to tailor properties of PCD compacts. The diamond sintering process requires use of a tungsten carbide cobalt disc placed onto diamond powder followed by high pressure and high temperature conditions. During this process pseudo-eutectic, WC-Co liquid from the tungsten carbide disc is infiltrated into diamond powder providing a liquid phase to facilitate inter-grain diamond bending. The amount and chemical composition with respect to carbon content of the liquid phase are dependent on average diamond grain size and its distribution. Finer diamond sizes tend to have higher sintered density than coarser sizes indicating a higher volume fraction of metallic content. The role of residual metallic content of the diamond layer in conjunction with average grain size on fracture toughness of the diamond layer was investigated. The fracture toughness was determined using a diametral compression test. Larger grain PCD compacts having lower amounts of matallic content were found to have a higher toughness than fine grained materials with higher amounts of residual metallic phase. PCD compacts of different starting diameter grain sizes were subjected to elevated temperatures under different gas environments and examined for their thermal resistance. The results are explained in terms of total metal content of the diamond layer in conjunction with the development of inter-grain diamond bonding.