네트워크

전기전자

전자패키지시스템

ESIP means Electro-package System and Interconnect Prodcut. This Lab is proceeding the portal site for electro-package of semiconductor, active, passive, and MEMS sensors. The Lab owner will manage on focusing the education and information sharing for packaging. Thanks again and great appreciate with your eager participation. Sincerely yours, Gusung Kim, Ph.D, Th.M.

국가

대한민국

소속기관

강남대학교 (학교)

연락처

031-280-3713 http://www.esip.or.kr/

책임자

김구성 gkim@kangnam.ac.kr

소속회원 0