KOSEN 한인과학기술자네트워크

Located adjacent to the University of Maryland's College Park Campus, the Laboratory for Physical Sciences is a unique facility where university and federal government personnel collaborate on research in advanced communication and computer technologies. Faculty, post-doctoral scientists, and students from the UMCP Departments of Physics, Electrical and Computer Engineering, and Materials and Nuclear Engineering all conduct research in LPS laboratories in the areas listed above. Microelectronics Integration The Microelectronics Integration effort at the Laboratory for Physical Sciences is a collection of fabrication technologies that merge back end-of-line (BEOL) semiconductor processing with advanced packaging techniques to enable improved high-perfomance computing technology development. Three primary approaches are being taken to miniaturize multi-chip systems to reduce area/volume while enhancing electrical performance and functionality. The primary objective of this effort is 3-dimensional integration (3DI) of bare commercial integrated circuits (ICs) using high density (>10M vias/cm2) through silicon vias (TSVs) in the space occupied by a chip-scale package (CSP ? Figure 1). Auxiliary technologies have stemmed from this initial effort and enabled High Density Silicon (HDS) and Thin Film Interconnect (TFI) carrier technology as low profile and flexible substrates to replace printed circuit boards (PCBs). Further scaling is achieved by depackaging (die harvesting) and thinning of commercial components using proprietary methods to retain electrical functionality of the bare die at thicknesses of 15 microns.