Research Field
Plasma diagnostics and simulations
TSV interconnection for 3D stacked packaging
Durability of transparent conducting multilayer
Development of new phase-change materials for PRAM applications
Growth of Vertically aligned CNT arrays
국가
대한민국
소속기관
한국과학기술원(KAIST) (학교)
연락처
042-350-4257 http://mse.kaist.ac.kr/~tfilm
책임자
이원종 wjlee@kaist.ac.kr
