2012-07-10
org.kosen.entty.User@13ece435
김소연(sykim0807)
Our research group focuses on mechanics-related subjects of advanced packaging and thin films: adhesion, deformation, fracture, fatigue, reliability, and stress/strain induced mutiphysics phenomena for the following applications.
Flexible display, fuel cell, solar cell, battery, electronic packaging, encapsulation, dry transfer, tensile / bending / folding / adhesion tests.