Our research group is composed of young students and scientists who love challenges and achievements in the newly discovered and developed engineering and scientific world.
We explore the new spectrums of electromagnetic waves that are needed to come up with the desired bandwidth of the future wired and wireless interconnection. Also the spectrum will quite useful for other application areas such as high-speed signal processing and wireless power transfer (WPT).
We have two different group of research including the signal integrity (SI) and power integrity (PI) in TSV-based 3D IC group and WPT group. In the 3D IC group, we are evaluating the design of signal lines and power distribution network (PDN) in 3D-IC and suggesting the optimized design and devices for improving the system performance. For the evaluation and design guide, we model and measure the signal lines and PDN in 3D IC in the frequency and time domain. Additionally, we propose RF devices to improve the system performance.